Vacuum V350

The V350 is a system designed to improve the quality of solder joints. Voids are reduced in a vacuum chamber, which significantly enhances the quality of the soldered product. Voids can be reduced by up to 99%, optimizing the quality of solder joints. The system accommodates double-sided PCBs and offers adjustable parameters such as evacuation time, vacuum hold time, ventilation time, and vacuum pressure. The vacuum chamber features only one sealing surface, ensuring a stable and reliable process. The system is engineered for the lowest total cost of ownership, with low energy consumption and minimal spare parts requirements.