Vacuum L

"Vacuum Plus" is a system designed to improve the quality of solder joints by reducing voids in a vacuum chamber, significantly enhancing the quality of the soldered product. Voids can be reduced by up to 99%, optimizing the quality of the solder joints. The system accommodates double-sided PCBs and provides adjustable parameters such as evacuation time, vacuum hold time, ventilation time, and vacuum pressure. The vacuum chamber features only one sealing surface, ensuring a stable and reliable process.