Vacuum L +

"Vacuum Plus" is a system for improving quality of solder joints. Voids are reduced in a vacuum chamber which significantly improves the quality of the soldered product.

  • Voids will be reduced up to 99%, solder joints quality optimized
  • Double sided PCB
  • Setting Parameter: evacuation time; vacuum hold time; ventilation time; vacuum pressure
  • Only one sealing surface of the vacuum chamber
Vacuum 1
Cycle time 37 s
Speed 1.30 m/min
Pre heat 5
Process lenght 6131 mm
Peak zones 4
Cooling zones 3

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