Vacuum L +
Variants
"Vacuum Plus" is a system designed to improve the quality of solder joints by reducing voids in a vacuum chamber, significantly enhancing the quality of the soldered product. Voids can be reduced by up to 99%, optimizing the quality of the solder joints. The system accommodates double-sided PCBs and provides adjustable parameters such as evacuation time, vacuum hold time, ventilation time, and vacuum pressure. The vacuum chamber features only one sealing surface, ensuring a stable and reliable process.
| Vacuum | 1 |
|---|---|
| Cycle time | 37 s |
| Speed | 1.30 m/min |
| Pre heat | 5 |
| Process lenght | 6131 mm |
| Peak zones | 4 |
| Cooling zones | 3 |
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