Vacuum S
Variants
"Vacuum Plus" is a system for improving quality of solder joints. Voids are reduced in a vacuum chamber which significantly improves the quality of the soldered product.
- Voids will be reduced up to 99%, solder joints quality optimized
- Double sided PCB
- Setting Parameter: evacuation time; vacuum hold time; ventilation time; vacuum pressure
- Only one sealing surface of the vacuum chamber
| Vacuum | 1 |
|---|---|
| Cycle time | 59 s |
| Speed | 0.80 m/min |
| Pre heat | 3 |
| Process lenght | 4057 mm |
| Peak zones | 3 |
| Cooling zones | 2 |
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