Series AOI
fielddefinition.productarea.model.name QX250
PCB size L: min 50 mm, max 405 mm W: min 40 mm, max 308 mm
Camera 80 Megapixel Sensor on each SIM module
Resolut 12 μm pixel size
Inspection speed 110 cm2/sec
Solder Joint and Other Defects Solder bridge, opens, lifted leads, wettability, excess and in sufficient solder, debris, Gold-finger contamination, pin-in-hole, bent pins, debris,and others
Image processing Statistical Appearance Modeling (SAM™ ) Technology. Option: Autonomous Image Interpretation (AI²) Technology
Data import Any column separated text file (Standard information required – ref. designator, XY, Angle, Part no.,)
Lamps Strobe White Light (with dark/bright field)

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